Tehnilised dokumendid
Spetsifikatsioonid:
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
6 Pin Female SOP
End 2
6 Pin Male DIP
End 1 Number of Contacts
6
End 2 Number of Contacts
6
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Päritoluriik
United Kingdom
Toote üksikasjad
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 22,00
€ 4,40 tk (pakis 5) (ilma käibemaksuta)
€ 27,28
€ 5,456 tk (pakis 5) (koos käibemaksuga)
5
€ 22,00
€ 4,40 tk (pakis 5) (ilma käibemaksuta)
€ 27,28
€ 5,456 tk (pakis 5) (koos käibemaksuga)
Lao andmed ajutiselt ei ole saadaval.
5
Lao andmed ajutiselt ei ole saadaval.
| kogus | Ühikuhind | Per Pakend |
|---|---|---|
| 5 - 120 | € 4,40 | € 22,00 |
| 125 - 370 | € 3,95 | € 19,75 |
| 375 - 995 | € 3,50 | € 17,50 |
| 1000 - 1995 | € 3,05 | € 15,25 |
| 2000+ | € 2,85 | € 14,25 |
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
6 Pin Female SOP
End 2
6 Pin Male DIP
End 1 Number of Contacts
6
End 2 Number of Contacts
6
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Päritoluriik
United Kingdom
Toote üksikasjad
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


