Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 28.96 x 20.57mm
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
BergquistDimensions
28.96 x 20.57mm
Thickness
0.015in
Length
28.96mm
Width
20.57mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Päritoluriik
United States
Toote üksikasjad
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.
€ 33,00
€ 3,30 tk (pakis 10) (ilma käibemaksuta)
€ 40,92
€ 4,092 tk (pakis 10) (koos käibemaksuga)
10
€ 33,00
€ 3,30 tk (pakis 10) (ilma käibemaksuta)
€ 40,92
€ 4,092 tk (pakis 10) (koos käibemaksuga)
10
Lao andmed ajutiselt ei ole saadaval.
Palun kontrollige hiljem uuesti.
| kogus | Ühikuhind | Per Pakend |
|---|---|---|
| 10 - 40 | € 3,30 | € 33,00 |
| 50 - 190 | € 3,20 | € 32,00 |
| 200 - 490 | € 2,95 | € 29,50 |
| 500 - 990 | € 2,85 | € 28,50 |
| 1000+ | € 2,80 | € 28,00 |
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
BergquistDimensions
28.96 x 20.57mm
Thickness
0.015in
Length
28.96mm
Width
20.57mm
Thermal Conductivity
3.5W/m·K
Material
Fibreglass
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+200°C
Hardness
Shore A 90
Material Trade Name
Sil-Pad 2000
Operating Temperature Range
-60 → +200 °C
Päritoluriik
United States
Toote üksikasjad
Bergquist Sil-Pad 2000
Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.