Tehnilised dokumendid
Spetsifikatsioonid:
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55932
Current Rating
3.0A
Voltage Rating
250.0 V
Päritoluriik
Japan
Toote üksikasjad
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
€ 3,29
€ 0,329 tk (pakis 10) (ilma käibemaksuta)
€ 4,08
€ 0,408 tk (pakis 10) (koos käibemaksuga)
Standard
10
€ 3,29
€ 0,329 tk (pakis 10) (ilma käibemaksuta)
€ 4,08
€ 0,408 tk (pakis 10) (koos käibemaksuga)
Standard
10
Lao andmed ajutiselt ei ole saadaval.
Palun kontrollige hiljem uuesti.
kogus | Ühikuhind | Per Pakend |
---|---|---|
10 - 240 | € 0,329 | € 3,29 |
250 - 990 | € 0,242 | € 2,42 |
1000 - 4990 | € 0,192 | € 1,92 |
5000 - 9990 | € 0,184 | € 1,84 |
10000+ | € 0,179 | € 1,79 |
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55932
Current Rating
3.0A
Voltage Rating
250.0 V
Päritoluriik
Japan
Toote üksikasjad
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.