Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Technical Document
Specifications
Brand
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Country of Origin
United States
Product details
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm
€ 66.50
€ 66.50 Each (Exc. Vat)
€ 81.13
€ 81.13 Each (inc. VAT)
1
€ 66.50
€ 66.50 Each (Exc. Vat)
€ 81.13
€ 81.13 Each (inc. VAT)
1
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price |
|---|---|
| 1 - 49 | € 66.50 |
| 50 - 99 | € 64.00 |
| 100 - 249 | € 59.50 |
| 250 - 499 | € 57.50 |
| 500+ | € 56.00 |
Technical Document
Specifications
Brand
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Country of Origin
United States
Product details
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm