Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 19.05 x 12.7mm

RS tootekood: 169-2341Bränd: BergquistTootja Part nr.: SP2000-0.015-00-054
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Tehnilised dokumendid

Spetsifikatsioonid:

Dimensions

19.05 x 12.7mm

Thickness

0.015in

Length

19.05mm

Width

12.7mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad 2000

Operating Temperature Range

-60 → +200 °C

Päritoluriik

United States

Toote üksikasjad

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.

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€ 1,45

tk (pakis 10) (ilma käibemaksuta)

€ 1,769

tk (pakis 10) (koos käibemaksuga)

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 19.05 x 12.7mm

€ 1,45

tk (pakis 10) (ilma käibemaksuta)

€ 1,769

tk (pakis 10) (koos käibemaksuga)

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 19.05 x 12.7mm
Lao andmed ajutiselt ei ole saadaval.

Osta lahtiselt

kogusÜhikuhindPer Pakend
10 - 90€ 1,45€ 14,50
100 - 490€ 1,45€ 14,50
500+€ 1,35€ 13,50

Tehnilised dokumendid

Spetsifikatsioonid:

Dimensions

19.05 x 12.7mm

Thickness

0.015in

Length

19.05mm

Width

12.7mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad 2000

Operating Temperature Range

-60 → +200 °C

Päritoluriik

United States

Toote üksikasjad

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.