Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil

RS tootekood: 674-4756Bränd: Fischer ElektronikTootja Part nr.: ICK BGA 14x14x10
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Kuva kõik kategoorias Heatsinks

Tehnilised dokumendid

Spetsifikatsioonid:

For Use With

Universal Square Alu

Length

14mm

Width

14mm

Height

10mm

Dimensions

14 x 14 x 10mm

Thermal Resistance

27.4K/W

Mounting

Adhesive Foil, Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

Päritoluriik

Germany

Toote üksikasjad

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

BGA Heatsinks

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Palun kontrollige hiljem uuesti.

Lao andmed ajutiselt ei ole saadaval.

€ 2,30

tk (ilma käibemaksuta)

€ 2,81

tk (koos käibemaksuga)

Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil

€ 2,30

tk (ilma käibemaksuta)

€ 2,81

tk (koos käibemaksuga)

Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil
Lao andmed ajutiselt ei ole saadaval.

Osta lahtiselt

kogusÜhikuhind
1 - 9€ 2,30
10 - 24€ 2,10
25 - 49€ 1,95
50 - 99€ 1,90
100+€ 1,75

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Tehnilised dokumendid

Spetsifikatsioonid:

For Use With

Universal Square Alu

Length

14mm

Width

14mm

Height

10mm

Dimensions

14 x 14 x 10mm

Thermal Resistance

27.4K/W

Mounting

Adhesive Foil, Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

Päritoluriik

Germany

Toote üksikasjad

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

BGA Heatsinks

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more