KEMET 100pF Multilayer Ceramic Capacitor MLCC, 200V dc V, ±5% , SMD
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
KEMETCapacitance
100pF
Voltage
200V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
C0G
Tolerance
±5%
Dimensions
2 x 1.25 x 0.78mm
Length
2mm
Depth
1.25mm
Height
0.78mm
Series
C
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Päritoluriik
Mexico
Toote üksikasjad
KEMET C0805 Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
€ 0,72
€ 0,029 tk (pakis 25) (ilma käibemaksuta)
€ 0,88
€ 0,035 tk (pakis 25) (koos käibemaksuga)
Standard
25
€ 0,72
€ 0,029 tk (pakis 25) (ilma käibemaksuta)
€ 0,88
€ 0,035 tk (pakis 25) (koos käibemaksuga)
Standard
25
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Tehnilised dokumendid
Spetsifikatsioonid:
Brand
KEMETCapacitance
100pF
Voltage
200V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
C0G
Tolerance
±5%
Dimensions
2 x 1.25 x 0.78mm
Length
2mm
Depth
1.25mm
Height
0.78mm
Series
C
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Päritoluriik
Mexico
Toote üksikasjad
KEMET C0805 Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.