Tehnilised dokumendid
Spetsifikatsioonid:
Brand
onsemiTransistor Type
NPN
Maximum DC Collector Current
50 mA
Maximum Collector Emitter Voltage
120 V
Package Type
SOT-23
Mounting Type
Surface Mount
Maximum Power Dissipation
300 mW
Minimum DC Current Gain
300
Transistor Configuration
Single
Maximum Collector Base Voltage
120 V
Maximum Emitter Base Voltage
5 V
Maximum Operating Frequency
110 MHz
Pin Count
3
Number of Elements per Chip
1
Dimensions
2.9 x 1.3 x 1.04mm
Maximum Operating Temperature
+150 °C
Toote üksikasjad
Small Signal NPN Transistors, Over 100V, Fairchild Semiconductor
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.
€ 12,40
€ 0,062 tk (pakis 200) (ilma käibemaksuta)
€ 15,13
€ 0,076 tk (pakis 200) (koos käibemaksuga)
Standard
200
€ 12,40
€ 0,062 tk (pakis 200) (ilma käibemaksuta)
€ 15,13
€ 0,076 tk (pakis 200) (koos käibemaksuga)
Standard
200
Lao andmed ajutiselt ei ole saadaval.
Palun kontrollige hiljem uuesti.
kogus | Ühikuhind | Per Pakend |
---|---|---|
200 - 800 | € 0,062 | € 12,40 |
1000 - 1800 | € 0,054 | € 10,80 |
2000+ | € 0,046 | € 9,20 |
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
onsemiTransistor Type
NPN
Maximum DC Collector Current
50 mA
Maximum Collector Emitter Voltage
120 V
Package Type
SOT-23
Mounting Type
Surface Mount
Maximum Power Dissipation
300 mW
Minimum DC Current Gain
300
Transistor Configuration
Single
Maximum Collector Base Voltage
120 V
Maximum Emitter Base Voltage
5 V
Maximum Operating Frequency
110 MHz
Pin Count
3
Number of Elements per Chip
1
Dimensions
2.9 x 1.3 x 1.04mm
Maximum Operating Temperature
+150 °C
Toote üksikasjad
Small Signal NPN Transistors, Over 100V, Fairchild Semiconductor
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.