Technical Document
Specifications
Brand
TDKInductance
33 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
900mΩ
Maximum Self Resonant Frequency
1.8GHz
Minimum Quality Factor
8
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Country of Origin
Japan
Product details
Chip Inductor MLG1005S Series
High-frequency (multilayer) chip inductor
Monolithic structure combining ceramic and conductive materials
For use with mobile phones, portable networking devices and other high-frequency circuits
€ 0.78
€ 0.078 Each (In a Pack of 10) (Exc. Vat)
€ 0.97
€ 0.097 Each (In a Pack of 10) (inc. VAT)
10
€ 0.78
€ 0.078 Each (In a Pack of 10) (Exc. Vat)
€ 0.97
€ 0.097 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
10
Stock information temporarily unavailable.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 90 | € 0.078 | € 0.78 |
| 100 - 240 | € 0.063 | € 0.63 |
| 250 - 490 | € 0.054 | € 0.54 |
| 500 - 990 | € 0.051 | € 0.51 |
| 1000+ | € 0.046 | € 0.46 |
Technical Document
Specifications
Brand
TDKInductance
33 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
900mΩ
Maximum Self Resonant Frequency
1.8GHz
Minimum Quality Factor
8
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Country of Origin
Japan
Product details
Chip Inductor MLG1005S Series
High-frequency (multilayer) chip inductor
Monolithic structure combining ceramic and conductive materials
For use with mobile phones, portable networking devices and other high-frequency circuits


