TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

RS tootekood: 718-1544Bränd: TE ConnectivityTootja Part nr.: 120954-1
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Tehnilised dokumendid

Spetsifikatsioonid:

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Contact Plating

Gold

Current Rating

16A

Termination Method

Press Fit

Series

Z-PACK

Päritoluriik

United States

Toote üksikasjad

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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Palun kontrollige hiljem uuesti.

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€ 10,60

€ 10,60 tk (ilma käibemaksuta)

€ 12,93

€ 12,93 tk (koos käibemaksuga)

TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way
Valige pakendi tüüp

€ 10,60

€ 10,60 tk (ilma käibemaksuta)

€ 12,93

€ 12,93 tk (koos käibemaksuga)

TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way
Lao andmed ajutiselt ei ole saadaval.
Valige pakendi tüüp

Osta lahtiselt

kogusÜhikuhind
1 - 19€ 10,60
20 - 74€ 10,10
75 - 299€ 9,50
300 - 599€ 8,80
600+€ 8,40

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Tehnilised dokumendid

Spetsifikatsioonid:

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Contact Plating

Gold

Current Rating

16A

Termination Method

Press Fit

Series

Z-PACK

Päritoluriik

United States

Toote üksikasjad

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more