TE Connectivity, Z-PACK HM 2 mm Pitch Hard Metric Type A Backplane Connector, Right Angle Male, 4 Column, 1 Row, 4 Way
Technical Document
Specifications
Brand
TE ConnectivityBackplane Connector Type
Hard Metric Type A
Product Type
Backplane Connector
Number of Contacts
4
Current
16A
Number of Columns
4
Orientation
Right Angle
Number of Rows
1
Connector Gender
Male
Voltage
250 V
Housing Material
Glass Filled Polyester
Pitch
2mm
Contact Material
Copper Alloy
Mount Type
Through Hole
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Press Fit
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Series
Z-PACK HM
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Stock information temporarily unavailable.
€ 475.00
€ 12.50 Each (In a Tube of 38) (Exc. Vat)
€ 589.00
€ 15.50 Each (In a Tube of 38) (inc. VAT)
38
€ 475.00
€ 12.50 Each (In a Tube of 38) (Exc. Vat)
€ 589.00
€ 15.50 Each (In a Tube of 38) (inc. VAT)
Stock information temporarily unavailable.
38
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Brand
TE ConnectivityBackplane Connector Type
Hard Metric Type A
Product Type
Backplane Connector
Number of Contacts
4
Current
16A
Number of Columns
4
Orientation
Right Angle
Number of Rows
1
Connector Gender
Male
Voltage
250 V
Housing Material
Glass Filled Polyester
Pitch
2mm
Contact Material
Copper Alloy
Mount Type
Through Hole
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Press Fit
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Series
Z-PACK HM
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products