Tehnilised dokumendid
Spetsifikatsioonid:
Brand
TE ConnectivityNumber Of Contacts
30
Number Of Rows
2
Pitch
1.27mm
Type
Socket Strip
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
12A
Voltage Rating
30 V
Series
AMPMODU System 50
Contact Material
Copper
PRICED TO CLEAR
Yes
Päritoluriik
United States
Toote üksikasjad
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.
Lao andmed ajutiselt ei ole saadaval.
Palun kontrollige hiljem uuesti.
€ 6,20
tk (torus 22) (ilma käibemaksuta)
€ 7,564
tk (torus 22) (koos käibemaksuga)
22
€ 6,20
tk (torus 22) (ilma käibemaksuta)
€ 7,564
tk (torus 22) (koos käibemaksuga)
22
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
TE ConnectivityNumber Of Contacts
30
Number Of Rows
2
Pitch
1.27mm
Type
Socket Strip
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
12A
Voltage Rating
30 V
Series
AMPMODU System 50
Contact Material
Copper
PRICED TO CLEAR
Yes
Päritoluriik
United States
Toote üksikasjad
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.