Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
6.3V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
2012-12
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
2mm
Depth
1.25mm
Maximum Operating Temperature
+105°C
Height
1.2mm
Dimensions
2 x 1.25 x 1.2mm
Series
T55
Electrolyte Type
Solid
Leakage Current
10 μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
€ 6.93
€ 0.693 Each (In a Pack of 10) (Exc. Vat)
€ 8.59
€ 0.859 Each (In a Pack of 10) (inc. VAT)
10
€ 6.93
€ 0.693 Each (In a Pack of 10) (Exc. Vat)
€ 8.59
€ 0.859 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
10
Stock information temporarily unavailable.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 90 | € 0.693 | € 6.93 |
| 100 - 490 | € 0.448 | € 4.48 |
| 500 - 1490 | € 0.329 | € 3.29 |
| 1500+ | € 0.264 | € 2.64 |
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
6.3V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
2012-12
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
2mm
Depth
1.25mm
Maximum Operating Temperature
+105°C
Height
1.2mm
Dimensions
2 x 1.25 x 1.2mm
Series
T55
Electrolyte Type
Solid
Leakage Current
10 μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
