Technical Document
Specifications
Brand
VPG Foil ResistorsResistance
10kΩ
Technology
Metal Foil
Package/Case
0805 (2012M)
Tolerance
±0.01%
Power Rating
0.2W
Temperature Coefficient
±0.2ppm/°C
Series
VSMP
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Product details
VSMP Series Ultra High Precision Z Foil Wraparound SMD Chip Resistors
VSMP Series ultra high precision Z Foil surface mount chip resistors offering proven reliability and excellent stability under different environmental conditions. The VSMPs full wraparound terminations ensure safe handling during the manufacturing process and provides stability during multiple thermal cycles. Applications for the VSMP resistor include; Automatic test equipment (ATE); high precision instrumentation; laboratory, industrial and medical; Audio; EB applications; Military and Space; Airborne; Down-hole instrumentation; Communication
€ 1,640.00
€ 16.40 Each (Supplied as a Tape) (Exc. Vat)
€ 2,033.60
€ 20.336 Each (Supplied as a Tape) (inc. VAT)
100
€ 1,640.00
€ 16.40 Each (Supplied as a Tape) (Exc. Vat)
€ 2,033.60
€ 20.336 Each (Supplied as a Tape) (inc. VAT)
Stock information temporarily unavailable.
100
Stock information temporarily unavailable.
Technical Document
Specifications
Brand
VPG Foil ResistorsResistance
10kΩ
Technology
Metal Foil
Package/Case
0805 (2012M)
Tolerance
±0.01%
Power Rating
0.2W
Temperature Coefficient
±0.2ppm/°C
Series
VSMP
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Product details
VSMP Series Ultra High Precision Z Foil Wraparound SMD Chip Resistors
VSMP Series ultra high precision Z Foil surface mount chip resistors offering proven reliability and excellent stability under different environmental conditions. The VSMPs full wraparound terminations ensure safe handling during the manufacturing process and provides stability during multiple thermal cycles. Applications for the VSMP resistor include; Automatic test equipment (ATE); high precision instrumentation; laboratory, industrial and medical; Audio; EB applications; Military and Space; Airborne; Down-hole instrumentation; Communication


