331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

RS tootekood: 773-4277Bränd: Wurth ElektronikTootja Part nr.: 331171302030
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Tehnilised dokumendid

Spetsifikatsioonid:

Brand

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

3mm

Length

3.15mm

Width_SC_PC

2mm

Toote üksikasjad

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Lao andmed ajutiselt ei ole saadaval.

Palun kontrollige hiljem uuesti.

Lao andmed ajutiselt ei ole saadaval.

€ 1,05

tk (pakis 5) (ilma käibemaksuta)

€ 1,281

tk (pakis 5) (koos käibemaksuga)

331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

5

Saadaval mitmekordselt 5
5€ 5,25
10€ 10,50
15€ 15,75
20€ 21,00
25€ 25,00
30€ 30,00
35€ 35,00
40€ 40,00
45€ 45,00
50€ 46,50
55€ 51,15
60€ 55,80
65€ 60,45
70€ 65,10
75€ 69,75

€ 1,05

tk (pakis 5) (ilma käibemaksuta)

€ 1,281

tk (pakis 5) (koos käibemaksuga)

331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm
Lao andmed ajutiselt ei ole saadaval.

5

Saadaval mitmekordselt 5
5€ 5,25
10€ 10,50
15€ 15,75
20€ 21,00
25€ 25,00
30€ 30,00
35€ 35,00
40€ 40,00
45€ 45,00
50€ 46,50
55€ 51,15
60€ 55,80
65€ 60,45
70€ 65,10
75€ 69,75

Osta lahtiselt

kogusÜhikuhindPer Kott
5 - 20€ 1,05€ 5,25
25 - 45€ 1,00€ 5,00
50 - 95€ 0,93€ 4,65
100 - 245€ 0,886€ 4,43
250+€ 0,798€ 3,99

Tehnilised dokumendid

Spetsifikatsioonid:

Brand

Wurth Elektronik

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

3mm

Length

3.15mm

Width_SC_PC

2mm

Toote üksikasjad

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.