Tehnilised dokumendid
Spetsifikatsioonid:
Brand
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Päritoluriik
United States
Toote üksikasjad
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
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€ 66,00
tk (ilma käibemaksuta)
€ 80,52
tk (koos käibemaksuga)
1
€ 66,00
tk (ilma käibemaksuta)
€ 80,52
tk (koos käibemaksuga)
1
Osta lahtiselt
kogus | Ühikuhind |
---|---|
1 - 49 | € 66,00 |
50 - 99 | € 63,50 |
100 - 249 | € 59,00 |
250 - 499 | € 57,00 |
500+ | € 55,50 |
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Päritoluriik
United States
Toote üksikasjad
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules