Tehnilised dokumendid
Spetsifikatsioonid:
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
84 Pin Female PLCC
End 2
84 Pin Male DIP
End 1 Number of Contacts
84
End 2 Number of Contacts
84
End 1 Type
PLCC
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Päritoluriik
United Kingdom
Toote üksikasjad
PLCC to DIP Sockets
Adaptics of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Lao andmed ajutiselt ei ole saadaval.
Palun kontrollige hiljem uuesti.
€ 32,80
tk (ilma käibemaksuta)
€ 40,02
tk (koos käibemaksuga)
1
€ 32,80
tk (ilma käibemaksuta)
€ 40,02
tk (koos käibemaksuga)
1
Osta lahtiselt
kogus | Ühikuhind |
---|---|
1 - 4 | € 32,80 |
5+ | € 31,00 |
Tehnilised dokumendid
Spetsifikatsioonid:
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
84 Pin Female PLCC
End 2
84 Pin Male DIP
End 1 Number of Contacts
84
End 2 Number of Contacts
84
End 1 Type
PLCC
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Päritoluriik
United Kingdom
Toote üksikasjad
PLCC to DIP Sockets
Adaptics of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.