Tehnilised Dokumendid
Spetsifikatsioonid:
Brand
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
18
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Termination Type
Through Hole
Maximum Operating Temperature
105°C
Päritoluriik
China
Toote üksikasjad
The Molex Micro-Fit 3.0 Vertical Header is expertly engineered for power and wire-to-board applications, delivering high reliability in demanding environments. This component features a Compact design with a 3.00mm pitch and dual-row configuration, accommodating up to 18 circuits. Its robust construction includes high-temperature thermoplastic materials and a gold-plated mating interface, ensuring durability and excellent electrical performance. With compliance to international safety standards, this header offers peace of mind for engineers seeking a dependable solution for their PCB header and receptacle needs, particularly in applications requiring a high-temperature performance. Additional features like full shrouding and a secure PCB retention mechanism make it an Ideal choice for Advanced electronics.
Lao andmed ajutiselt ei ole saadaval.
€ 11,00
€ 11,00 1 pakk 2 tk (ilma käibemaksuta)
€ 13,64
€ 13,64 1 pakk 2 tk (koos käibemaksuga)
1
€ 11,00
€ 11,00 1 pakk 2 tk (ilma käibemaksuta)
€ 13,64
€ 13,64 1 pakk 2 tk (koos käibemaksuga)
Lao andmed ajutiselt ei ole saadaval.
1
| kogus | Ühikuhind |
|---|---|
| 1 - 9 | € 11,00 |
| 10 - 24 | € 10,10 |
| 25+ | € 9,10 |
Tehnilised Dokumendid
Spetsifikatsioonid:
Brand
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
18
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Through Hole
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Termination Type
Through Hole
Maximum Operating Temperature
105°C
Päritoluriik
China
Toote üksikasjad
The Molex Micro-Fit 3.0 Vertical Header is expertly engineered for power and wire-to-board applications, delivering high reliability in demanding environments. This component features a Compact design with a 3.00mm pitch and dual-row configuration, accommodating up to 18 circuits. Its robust construction includes high-temperature thermoplastic materials and a gold-plated mating interface, ensuring durability and excellent electrical performance. With compliance to international safety standards, this header offers peace of mind for engineers seeking a dependable solution for their PCB header and receptacle needs, particularly in applications requiring a high-temperature performance. Additional features like full shrouding and a secure PCB retention mechanism make it an Ideal choice for Advanced electronics.