Tehnilised Dokumendid
Spetsifikatsioonid:
Brand
SamtecNumber of Contacts
320
Product Type
PCB Socket
Number of Rows
8
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Voltage
240V
Series
SEAF
Minimum Operating Temperature
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Toote üksikasjad
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Lao andmed ajutiselt ei ole saadaval.
€ 5 445,00
€ 24,20 tk (rullis 225) (ilma käibemaksuta)
€ 6 751,80
€ 30,008 tk (rullis 225) (koos käibemaksuga)
225
€ 5 445,00
€ 24,20 tk (rullis 225) (ilma käibemaksuta)
€ 6 751,80
€ 30,008 tk (rullis 225) (koos käibemaksuga)
Lao andmed ajutiselt ei ole saadaval.
225
Tehnilised Dokumendid
Spetsifikatsioonid:
Brand
SamtecNumber of Contacts
320
Product Type
PCB Socket
Number of Rows
8
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Voltage
240V
Series
SEAF
Minimum Operating Temperature
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Toote üksikasjad
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.